Call for papers...!!!
11th International Conference on Signal, Image Processing and Pattern Recognition (SPPR 2022)
November 26 ~ 27, 2022, London, United Kingdom
https://iccsea2022.org/sppr/index
Submission Deadline : October 01, 2022
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sppr@iccsea2022.org or spprconf@yahoo.com
Submission Link:
https://iccsea2022.org/submission/index.php
Call for papers...!!!
8th International Conference on Information Technology Converge Services (ITCON 2022)
November 19 ~ 20, 2022, Zurich, Switzerland
https://www.csea2022.org/itcon/index
Submission Deadline: October 01, 2022
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Here's where you can reach us : itcon@csea2022.org (or) itconconf@yahoo.com
https://www.csea2022.org/submission/index.php
Call For Papers...!!!
International Journal of Advanced Information Technology (IJAIT)
Webpage URL:https://airccse.org/journal/IJAIT/ijait.html
Submission Deadline : October 01, 2022
Contact us:
Here's where you can reach us : ijhas.journal@yahoo.com or ijhas.journal@airccse.com
Submission URL:http://coneco2009.com/submissions/imagination/home.html
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Call for papers !!!
International Journal of Advanced Information Technology (IJAIT)
Website URL : https://airccse.org/journal/IJAIT/ijait.html
Submission Deadline :September 24, 2022
Contact Us : ijhas.journal@yahoo.com or ijhas.journal@airccse.com
3rd International Conference on NLP Trends & Technologies (NLPTT 2022)
December 17 ~ 18, 2022, Dubai, UAE
Webpage URL:https://cse2022.org/nlptt/index
Submission Deadline : September 25, 2022
Contact us:
Here's where you can reach us : nlptt@cse2022.org or nlpttconf@yahoo.com
Submission URL:https://cse2022.org/submission/index.php
#IJAIT #thermaleffects #Computing #BigData
A Novel Methodlogy For Thermal Ananalysis & 3-Dimensional Memory Integration
Authors
Annmol Cherian, Ajay Augustine, Jemy Jose and Vinod Pangracious
Abstract
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However, recently Moore’s law has come to a stand-still since device scaling beyond 65 nm is not practical. 2D integration has problems like memory latency, power dissipation, and large foot-print. 3D technology comes as a solution to the problems posed by 2D integration. The utilization of 3D is limited by the problem of temperature crisis. It is important to develop an accurate power profile extraction methodology to design 3D structure. In this paper, design of 3D integration of memory is considered and hence the static power dissipation of the memory cell is analysed in transistor level and is used to accurately model the inter-layer thermal effects for 3D memory stack. Subsequently, packaging of the chip is considered and modelled using an architecture level simulator. This modelling is intended to analyse the thermal effects of 3D memory, its reliability and lifetime of the chip, with greater accuracy
Keywords
3D integration, 3Dmemory, Thermal effects, TSV
https://airccse.org/journal/IJAIT/papers/0811ijait03.pdf
An efficient simulated annealing algorithm for a No-Wait Two Stage Flexible Flow Shop Scheduling Problem
M. Rabiee1 , P. Ramezani2 and R. Shafaei3
1 Department of Industrial Engineering, K. N. Toosi University of Technology, Tehran, Iran
2Department of Industrial Engineering, K. N. Toosi University of Technology, Tehran, Iran
3 Department of Industrial Engineering, K. N. Toosi University of Technology, Tehran, Iran
ABSTRACT
In this paper, no wait two stage flexible flow shop scheduling problem (FFSSP) is solved using two metaheuristic algorithms. This problem with minimum makespan performance measure is NP-Hard. The proposed algorithms are Simulated Annealing and Genetic Algorithm. The results are analyzed in terms of Relative Percentage Deviation of Makespan. The performance of the proposed algorithms are studied and compared with that of MDA algorithm. For this propose a number of problems in different sizes are solved. The results of the studies proposes the effective algorithm. This is followed by describing the outline of the study, concluding remarks and suggesting potential areas for further researches
KEYWORDS:
No wait, Two stage, Flexible flow shop, Makespan, Simulated annealing, Genetic algorithm. .
Pdf URL:
Paper Submission..!!
International Journal of Advanced Information Technology (IJAIT)
ISSN : 2231 – 1548[online] ;2231 – 1920[print]
Web page Link: https://airccse.org/journal/IJAIT/ijait.html
Submission Deadline: September 10, 2022
Submission link: http://coneco2009.com/submissions/imagination/home.html
Contact Us: ijaitjournal@airccse.org or ijait@aircconline.com or ijaitjournal@yahoo.com
Ontology Visualization Protege Tools - A Review
R. Sivakumar1 and P.V. Arivoli2
1 Associate Professor, Department of Computer Science, A.V.V.M. Sri Pushpam College, Bharathidasan University, Trichirappalli, India
2 Project Fellow, Department of Computer Science, A.V.V.M. Sri Pushpam College, Bharathidasan University, Trichirappalli, India
ABSTRACT
Protégé is one of the most popular tools of the ontology visualization. The “Protégé” tools are being applied for further development in various disciplines for better understanding of knowledge. These tools commonly use four methods of ontology visualization, namely, indented list, node-link and tree, zoomable, and focus+context. The purpose of this work is to present a study on application of these four methods in the development of different kinds of protégé visualization tools and categorize their characteristics and features so that it assists in method selection and promotes further future research in the area of ontology visualization.
KEYWORDS:
Ontology visualization techniques, Protégé tools, Knowledge bases, Knowledge models.
Pdf URL:
Call For Papers......!! #advancesinAI #softcomputing #bigdata #blockchain #communications #database #digitalfabrication #machinelearning #i...
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